US 12,074,054 B2
Wafer processing apparatus and wafer processing method
Woon Kong, Cheonan-si (KR); Ji Hoon Song, Cheonan-si (KR); Ung Jo Moon, Osan-si (KR); and Ji Ho Park, Hwaseong-si (KR)
Assigned to ZEUS CO., LTD., Hwaseong-si (KR)
Filed by ZEUS CO., LTD., Hwaseong-si (KR)
Filed on Aug. 20, 2021, as Appl. No. 17/407,567.
Claims priority of application No. 10-2020-0106760 (KR), filed on Aug. 25, 2020.
Prior Publication US 2022/0068696 A1, Mar. 3, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6838 (2013.01) [H01L 21/68721 (2013.01); H01L 21/68764 (2013.01); H01L 21/68728 (2013.01); Y10T 279/11 (2015.01)] 8 Claims
OG exemplary drawing
 
1. A wafer processing apparatus comprising:
a vacuum chuck on which a wafer is seated;
a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck; and
a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover,
wherein a deformation space is formed inside the sealing ring to allow the sealing ring to be deformed when the ring cover presses, and
wherein a hook portion is formed on the vacuum chuck, and the hook portion confines the sealing ring to prevent the sealing ring from being separated from the vacuum chuck.