US 12,074,052 B2
Forming mesas on an electrostatic chuck
Wendell Glenn Boyd, Jr., Morgan Hill, CA (US); Stanley Wu, San Ramon, CA (US); and Matthew Boyd, Morgan Hill, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 7, 2023, as Appl. No. 18/206,931.
Application 18/206,931 is a continuation of application No. 17/183,179, filed on Feb. 23, 2021, granted, now 11,699,611.
Prior Publication US 2023/0326780 A1, Oct. 12, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/683 (2006.01); C23C 16/02 (2006.01); C23C 16/30 (2006.01); C23C 16/458 (2006.01)
CPC H01L 21/6833 (2013.01) [C23C 16/0227 (2013.01); C23C 16/308 (2013.01); C23C 16/4583 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for preparing a body of an electrostatic chuck, the method comprising:
polishing a surface of the body to create a polished surface;
cleaning the polished surface of the body;
depositing mesas on the polished surface of the body, wherein each mesa comprises:
an adhesion layer on the polished surface of the body;
a transition layer over the adhesion layer; and
a coating layer over the transition layer; and
polishing the mesas.