US 12,074,049 B2
Permanent secondary erosion containment for electrostatic chuck bonds
Eric A. Pape, Campbell, CA (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Filed by LAM RESEARCH CORPORATION, Fremont, CA (US)
Filed on Jun. 25, 2019, as Appl. No. 16/452,462.
Application 16/452,462 is a continuation of application No. 15/157,959, filed on May 18, 2016, granted, now 10,340,171, issued on Jul. 2, 2019.
Prior Publication US 2019/0311935 A1, Oct. 10, 2019
Int. Cl. H01L 21/683 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6833 (2013.01) [C23C 16/4404 (2013.01); C23C 16/4409 (2013.01); C23C 16/45544 (2013.01); C23C 16/4583 (2013.01); H01J 37/32082 (2013.01); H01J 37/32477 (2013.01); H01J 37/32513 (2013.01); H01J 37/32715 (2013.01); H01L 21/6831 (2013.01); H01L 21/68735 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); H01J 2237/334 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A substrate support for a substrate processing chamber, the substrate support comprising:
a baseplate;
a ceramic layer bonded to the baseplate;
a seal provided in an outer perimeter of an interface between the ceramic layer and the baseplate, wherein the seal is arranged to seal the interface from the substrate processing chamber, and wherein the seal includes
an adhesive arranged in the outer perimeter of the interface between the ceramic layer and the baseplate, wherein the adhesive comprises a first material, and
a ring arranged in the outer perimeter of the interface between the ceramic layer and the baseplate, wherein the ring is removable and comprises a second material having a greater resistance to plasma erosion than the first material; and
a bond layer provided between the ceramic layer and the baseplate, wherein
the adhesive is formed as an inner layer around an outer perimeter of the bond layer,
an inner surface of the adhesive is adhered to the outer perimeter of the bond layer,
an outer surface of the adhesive is concave,
the ring is arranged as an outer layer radially outside of the inner layer such that the inner layer is located between the outer layer and the bond layer, and
the ring comprises an O-ring having an outer surface extending into the concave outer surface of the adhesive.