US 12,074,048 B2
Substrate processing apparatus and substrate processing method
Hiroki Harada, Kumamoto (JP); Tatsuhiko Tsujihashi, Kumamoto (JP); Tokutarou Hayashi, Kumamoto (JP); Tsuyoshi Otsuka, Kumamoto (JP); and Yuji Kawaguchi, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jun. 2, 2021, as Appl. No. 17/336,322.
Claims priority of application No. 2020-096601 (JP), filed on Jun. 3, 2020.
Prior Publication US 2021/0384058 A1, Dec. 9, 2021
Int. Cl. H01L 21/68 (2006.01); B25J 19/02 (2006.01); B65G 47/90 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/681 (2013.01) [B25J 19/021 (2013.01); B65G 47/90 (2013.01); H01L 21/67259 (2013.01); H01L 21/68707 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a substrate processing unit that holds and processes a substrate;
a substrate transfer unit that has a rotational axis and carries the substrate in the substrate processing unit;
a first sensor that detects a position of the substrate transfer unit relative to the substrate processing unit in a direction of travel thereof under a condition the substrate is carried in the substrate processing unit in the direction of travel;
a second sensor that detects a position of the substrate transfer unit relative to the substrate processing unit in a direction that is perpendicular to the direction of travel; and
a third sensor that detects an inclination of the rotational axis of the substrate transfer unit relative to the substrate processing unit.