US 12,074,047 B2
Display device manufacturing method, and substrate for manufacture of display device
Bongchu Shim, Seoul (KR); Jinsung Kim, Seoul (KR); Hyunho Lee, Seoul (KR); and Gunho Kim, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Appl. No. 17/618,108
Filed by LG ELECTRONICS INC., Seoul (KR)
PCT Filed Feb. 11, 2020, PCT No. PCT/KR2020/001881
§ 371(c)(1), (2) Date Dec. 10, 2021,
PCT Pub. No. WO2020/262792, PCT Pub. Date Dec. 30, 2020.
Claims priority of application No. 10-2019-0078220 (KR), filed on Jun. 28, 2019.
Prior Publication US 2022/0328335 A1, Oct. 13, 2022
Int. Cl. H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01)
CPC H01L 21/68 (2013.01) [H01L 21/6833 (2013.01); H01L 25/0753 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An assembly board for use in a method for manufacturing a display device which allows semiconductor light emitting diodes to be seated at preset positions on the assembly board using an electric field and a magnetic field, the assembly board comprising:
a base portion;
a plurality of assembly electrodes extending in one direction and disposed on the base portion;
a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; and
barrier ribs having a plurality of grooves for guiding the semiconductor light emitting diodes to the preset positions and formed on the base portion,
wherein each of the plurality of grooves is arranged to overlap only one assembly electrode of the plurality of assembly electrodes so that an electric field is formed between the plurality of grooves adjacent to each other.