US 12,074,044 B2
Wafer-like sensor
Felix J. Schuda, Saratoga, MN (US); and Mark C. LeClair, Lake Elmo, MN (US)
Assigned to CyberOptics Corporation, Golden Valley, MN (US)
Filed by CyberOptics Corporation, Golden Valley, MN (US)
Filed on Nov. 8, 2019, as Appl. No. 16/678,278.
Claims priority of provisional application 62/767,251, filed on Nov. 14, 2018.
Prior Publication US 2020/0152494 A1, May 14, 2020
Int. Cl. B32B 17/10 (2006.01); G05B 19/418 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/67276 (2013.01) [B32B 17/10036 (2013.01); B32B 17/10137 (2013.01); B32B 17/1044 (2013.01); B32B 17/1055 (2013.01); B32B 17/10651 (2013.01); B32B 17/10733 (2013.01); B32B 17/10899 (2013.01); B32B 17/10981 (2013.01); G05B 19/41875 (2013.01); H01L 22/34 (2013.01); G05B 2219/32179 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A wafer-like semiconductor sensor assembly, comprising:
a wafer-like base formed of a plurality of layers of chemically-hardened glass, the wafer- like base defining a recessed pocket therein; and
an electronics module having a housing and a plurality of electrical components disposed within the housing, wherein the housing is at least partially disposed within the recessed pocket of the wafer-like base and contains a sensor, wherein the sensor is selected from the group consisting of a positional sensor, a particle sensor, a speed sensor, a humidity sensor, an acceleration sensor, a vibration sensor, and a leveling sensor.