CPC H01L 21/31116 (2013.01) [H01J 37/32009 (2013.01); H01J 37/3244 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H01L 21/67103 (2013.01); H01L 21/67126 (2013.01); H01L 21/6719 (2013.01); H01L 21/67201 (2013.01); H01J 2237/334 (2013.01); H01L 21/823431 (2013.01); H01L 29/66742 (2013.01); H01L 29/66795 (2013.01)] | 20 Claims |
1. A device comprising:
a chamber defined by a chamber wall;
a wafer holding stage within the chamber;
a door in the chamber wall, the door configured to allow access to the chamber, the door comprising:
an attachment structure connected to the chamber wall;
a main structure having a first center portion and having a first outer periphery portion, the first outer periphery portion of the main structure surrounding the first center portion of the main structure; and
hinges connecting the main structure to the attachment structure, the hinges allowing the main structure to rotate about the attachment structure;
a heater configured to heat the door to a predetermined temperature; and
a heat shield covering the door, the heat shield comprising:
a metal plate exposed to the chamber; and
a teflon membrane between the metal plate and the door, the teflon membrane having a second center portion and having a second outer periphery portion, the second outer periphery portion of the teflon membrane surrounding the second center portion of the teflon membrane, the second center portion of the teflon membrane covered by the metal plate, the second outer periphery portion of the teflon membrane uncovered by the metal plate, the first center portion of the main structure covered by the teflon membrane, the first outer periphery portion of the main structure uncovered by the teflon membrane.
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