US 12,074,032 B2
Heat shield for chamber door and devices manufactured using same
Meng-Je Chuang, Hsinchu (TW); Wan-Chun Kuan, Chiayi (TW); Yi-Wei Chiu, Kaohsiung (TW); and Tzu-Chan Weng, Kaohsiung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jun. 7, 2021, as Appl. No. 17/340,766.
Application 17/340,766 is a continuation of application No. 15/406,143, filed on Jan. 13, 2017, granted, now 11,031,252.
Claims priority of provisional application 62/428,466, filed on Nov. 30, 2016.
Prior Publication US 2021/0296135 A1, Sep. 23, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/311 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H01L 21/67 (2006.01); H01L 21/8234 (2006.01); H01L 29/66 (2006.01)
CPC H01L 21/31116 (2013.01) [H01J 37/32009 (2013.01); H01J 37/3244 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H01L 21/67103 (2013.01); H01L 21/67126 (2013.01); H01L 21/6719 (2013.01); H01L 21/67201 (2013.01); H01J 2237/334 (2013.01); H01L 21/823431 (2013.01); H01L 29/66742 (2013.01); H01L 29/66795 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a chamber defined by a chamber wall;
a wafer holding stage within the chamber;
a door in the chamber wall, the door configured to allow access to the chamber, the door comprising:
an attachment structure connected to the chamber wall;
a main structure having a first center portion and having a first outer periphery portion, the first outer periphery portion of the main structure surrounding the first center portion of the main structure; and
hinges connecting the main structure to the attachment structure, the hinges allowing the main structure to rotate about the attachment structure;
a heater configured to heat the door to a predetermined temperature; and
a heat shield covering the door, the heat shield comprising:
a metal plate exposed to the chamber; and
a teflon membrane between the metal plate and the door, the teflon membrane having a second center portion and having a second outer periphery portion, the second outer periphery portion of the teflon membrane surrounding the second center portion of the teflon membrane, the second center portion of the teflon membrane covered by the metal plate, the second outer periphery portion of the teflon membrane uncovered by the metal plate, the first center portion of the main structure covered by the teflon membrane, the first outer periphery portion of the main structure uncovered by the teflon membrane.