| CPC H01L 21/0272 (2013.01) [H01L 21/0275 (2013.01)] | 20 Claims |
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1. A method of forming a semiconductor device, comprising:
forming at least one layer over a substrate;
forming a layer of light-sensitive material over the at least one layer;
removing a portion of the layer of light-sensitive material;
exposing remaining portions of the layer of light-sensitive material to a polarized electromagnetic radiation; and
directing a polarized electromagnetic radiation to a feature on the substrate, the polarized electromagnetic radiation to which the remaining portions of the layer of light-sensitive material is exposed being polarized in a direction different from a direction the polarized electromagnetic radiation directed to a feature on the substrate is polarized.
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