US 12,074,020 B2
Etching compositions
Mick Bjelopavlic, Chandler, AZ (US); and Carl Ballesteros, San Tan Valley, AZ (US)
Assigned to Fujifilm Electronic Materials U.S.A., Inc., N. Kingstown, RI (US)
Filed by Fujifilm Electronic Materials U.S.A., Inc., N. Kingstown, RI (US)
Filed on Oct. 6, 2022, as Appl. No. 17/960,895.
Claims priority of provisional application 63/254,625, filed on Oct. 12, 2021.
Prior Publication US 2023/0112795 A1, Apr. 13, 2023
Int. Cl. H01L 21/02 (2006.01); H01L 21/306 (2006.01)
CPC H01L 21/02019 (2013.01) [H01L 21/30604 (2013.01)] 37 Claims
 
1. An etching composition, comprising:
at least one fluorine-containing acid, the at least one fluorine-containing acid comprising hydrofluoric acid or hexafluorosilicic acid;
at least one oxidizing agent;
at least one organic acid or an anhydride thereof, the at least one organic acid comprising formic acid, acetic acid, propionic acid, or butyric acid;
at least one polymerized naphthalene sulfonic acid;
at least one hexafluorosilicate salt;
at least one amine, the at least one amine comprising an amine of formula (I): N—R1R2R3, wherein R1 is C1-C8 alkyl optionally substituted by OH or NH2, R2 is H or C1-C8 alkyl optionally substituted by OH, and R3 is C1-C8 alkyl optionally substituted by OH; and
water.