US 12,073,998 B2
Multilayer electronic component
Min Seop Kim, Suwon-si (KR); and Kyoung Jin Cha, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 29, 2022, as Appl. No. 17/733,041.
Claims priority of application No. 10-2021-0182614 (KR), filed on Dec. 20, 2021.
Prior Publication US 2023/0197349 A1, Jun. 22, 2023
Int. Cl. H01G 4/00 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/232 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including dielectric layers and a plurality of internal electrodes stacked on each other in a first direction, while having the dielectric layer interposed therebetween;
margin portions disposed on opposite surfaces of the body in a second direction perpendicular to the first direction; and
external electrodes disposed on opposite surfaces of the body in a third direction perpendicular to the first and second directions, and respectively connected to the internal electrodes,
wherein each of the margin portions includes a protection region, in which a plurality of metal particles are disposed, in at least one of upper or lower portions thereof in the first direction such that respective protection regions in the at least one of upper or lower portions of the margin portions are spaced apart from each other in the second direction.