US 12,073,996 B2
Ceramic electronic device, powder material, paste material, and manufacturing method of ceramic electronic device
Kotaro Mizuno, Takasaki (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Feb. 23, 2022, as Appl. No. 17/678,917.
Claims priority of application No. 2021-032057 (JP), filed on Mar. 1, 2021; and application No. 2021-032058 (JP), filed on Mar. 1, 2021.
Prior Publication US 2022/0277897 A1, Sep. 1, 2022
Int. Cl. H01G 4/008 (2006.01); B22F 1/05 (2022.01); C22C 19/03 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/008 (2013.01) [B22F 1/05 (2022.01); C22C 19/03 (2013.01); H01G 4/30 (2013.01); B22F 2301/15 (2013.01); B22F 2304/05 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A ceramic electronic device comprising:
a multilayer chip in which each of a plurality of dielectric layers of which a main component is ceramic, and each of a plurality of internal electrode layers are alternately stacked,
wherein the plurality of internal electrode layers include Ni, S and Sn,
wherein each of the plurality of internal electrode layers includes a Ni layer of which a main component is Ni, in a center portion thereof in a thickness direction,
wherein each of the plurality of internal electrode layers includes a high Sn concentration portion and a high S concentration portion,
wherein the high Sn concentration portion has a higher Sn concentration than the Ni layer and is closer to each of the plurality of dielectric layers than the Ni layer, and
wherein the high S concentration portion has a higher S concentration than the high Sn concentration portion and is closer to each of the plurality of dielectric layers than the high Sn concentration portion.