US 12,073,988 B2
Coil component
Han Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 26, 2021, as Appl. No. 17/213,807.
Claims priority of application No. 10-2020-0172519 (KR), filed on Dec. 10, 2020.
Prior Publication US 2022/0189685 A1, Jun. 16, 2022
Int. Cl. H01F 27/32 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01)
CPC H01F 27/324 (2013.01) [H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01F 2017/002 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A coil component, comprising:
a body including an insulating substrate having a first surface and a second surface opposing each other; and
a coil portion disposed on the insulating substrate,
wherein the coil portion comprises first and second upper patterns disposed on the first surface of the insulating substrate to be spaced apart from each other in a first direction, first and second lower patterns disposed on the second surface of the insulating substrate to be spaced apart from each other, and first and second vias each penetrating through the insulating substrate and disposed to be adjacent to each other in the first direction,
wherein a cross-sectional area of an upper end portion of the first via in contact with the first upper pattern is smaller than a cross-sectional area of an upper end portion of the second via in contact with the second upper pattern,
wherein a cross-sectional area of a lower end portion of the first via is greater than a cross-sectional area of a lower end portion of the second via,
wherein the body further includes upper and lower cover layers disposed on the first and second surfaces of the insulating substrate, respectively, and side surface cover layers disposed on both side surfaces of the insulating substrate, respectively, opposing each other in the first direction, and
wherein the upper and lower cover layers and the side surface cover layers include a material different from a material of the insulating substrate.