US 12,073,973 B1
Opposite-facing interleaved transformer design
Jing Jing, San Jose, CA (US); and Shuxian Wu, San Jose, CA (US)
Assigned to XILINX, INC., San Jose, CA (US)
Filed by XILINX, INC., San Jose, CA (US)
Filed on Feb. 19, 2021, as Appl. No. 17/180,411.
Int. Cl. H01F 27/00 (2006.01); H01F 27/28 (2006.01)
CPC H01F 27/006 (2013.01) [H01F 27/2804 (2013.01); H01F 27/2885 (2013.01); H01F 2027/2809 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) device, comprising:
a first metal layer comprising a first coil of a first inductor, and a first coil of a second inductor adjacent to the first coil of the first inductor;
a second metal layer comprising a second coil of the first inductor, a second coil of the second inductor adjacent to the second coil of the first inductor, and legs of the first and second inductors;
wherein the first and second coils of the first inductor are vertically aligned with one another and connected to one another through a first set of vias of a dielectric material positioned between the first and second metal layers;
wherein the first and second coils of the second inductor are vertically aligned with one another and connected to one another through a second set of vias of the dielectric material; and
wherein the first and the second inductors are configured as a transformer.