US 12,073,224 B2
Autoconfiguration of hardware components of various modules of a substrate processing tool
Bridget Hill, Mountain View, CA (US); Scott Baldwin, Reston, VA (US); Thomas A. Stubblebine, Fremont, CA (US); Rainer Unterguggenberger, Newark, CA (US); and Raymond Chau, San Ramon, CA (US)
Assigned to LAM RESEARCH CORPORATION, Fremont, CA (US)
Appl. No. 17/788,644
Filed by LAM RESEARCH CORPORATION, Fremont, CA (US)
PCT Filed Nov. 13, 2020, PCT No. PCT/US2020/060369
§ 371(c)(1), (2) Date Jun. 23, 2022,
PCT Pub. No. WO2021/141665, PCT Pub. Date Jul. 15, 2021.
Claims priority of provisional application 62/957,588, filed on Jan. 6, 2020.
Prior Publication US 2023/0030233 A1, Feb. 2, 2023
Int. Cl. G06F 9/4401 (2018.01); G06F 9/445 (2018.01); G06F 15/177 (2006.01)
CPC G06F 9/4401 (2013.01) [G06F 9/44505 (2013.01); G06F 15/177 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A substrate processing system comprising:
a module of the substrate processing system configured to perform an operation associated with processing a semiconductor substrate in the substrate processing system, the operation comprising a deposition or etching process, the module including:
a component used with the processing of the semiconductor substrate; and
a file stored in the module, the file including information about the component of the module, the information comprising at least one of a part number, a serial number, a manufacturing date, and a location of the component in the module; and
a controller of the substrate processing system configured to:
communicate with the module via a network of the substrate processing system;
receive the file from the module via the network of the substrate processing system;
read the information about the component from the received file;
correlate the information about the component that is read from the received file to a corresponding option from a plurality of options in an application used to configure the module, the plurality of options configuring different components based on their respective information to perform the deposition or etching process;
automatically select the option from the plurality of options in the application, to which the information about the component of the module is correlated, to configure the component of the module;
automatically configure the component of the module using the automatically selected option; and
perform the operation associated with processing the semiconductor substrate in the substrate processing system using the automatically configured component of the module.