US 12,073,170 B2
Integrated circuit, system for and method of forming an integrated circuit
Jung-Chan Yang, Hsinchu (TW); Ting-Wei Chiang, Hsinchu (TW); Cheng-I Huang, Hsinchu (TW); Hui-Zhong Zhuang, Hsinchu (TW); Chi-Yu Lu, Hsinchu (TW); and Stefan Rusu, Sunnyvale, CA (US)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Jul. 18, 2023, as Appl. No. 18/354,423.
Application 18/354,423 is a continuation of application No. 17/106,876, filed on Nov. 30, 2020, granted, now 11,704,465.
Application 17/106,876 is a continuation of application No. 15/643,825, filed on Jul. 7, 2017, granted, now 10,854,499, issued on Dec. 1, 2020.
Claims priority of provisional application 62/427,749, filed on Nov. 29, 2016.
Prior Publication US 2023/0359803 A1, Nov. 9, 2023
Int. Cl. G06F 30/394 (2020.01); H01L 21/76 (2006.01); H01L 23/528 (2006.01); H03K 19/094 (2006.01); H01L 23/522 (2006.01)
CPC G06F 30/394 (2020.01) [H01L 21/76 (2013.01); H01L 23/528 (2013.01); H01L 23/5286 (2013.01); H03K 19/094 (2013.01); H01L 23/5226 (2013.01); H01L 2924/0002 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit structure comprising:
a first power rail extending in a first direction and being located at a first level;
a second power rail extending in the first direction and being located at the first level, the second power rail being separated from the first power rail in a second direction different from the first direction;
a third power rail extending in the first direction and being located at the first level, the third power rail being separated from the first power rail and the second power rail in the second direction;
a first set of conductive structures extending in the second direction, over the first power rail and being located at a second level different than the first level;
a second set of conductive structures extending in the second direction, over the second power rail, being located at the second level, and being separated from the first set of conductive structures in the second direction;
a third set of conductive structures extending in the second direction, over the third power rail, being located at the second level, and being separated from the first set of conductive structures and the second set of conductive structures in the second direction;
a first conductive structure extending in the second direction, overlapping a first conductive structure of the first set of conductive structures, a first conductive structure of the second set of conductive structures and a first conductive structure of the third set of conductive structures, and being located at a third level different than the first level and the second level;
a second conductive structure extending in the second direction, overlapping a second conductive structure of the first set of conductive structures, a second conductive structure of the second set of conductive structures and a second conductive structure of the third set of conductive structures, being located at the third level, and being separated from the first conductive structure in the first direction; and
a third conductive structure extending in the second direction, overlapping a third conductive structure of the first set of conductive structures, a third conductive structure of the second set of conductive structures and a third conductive structure of the third set of conductive structures, being located at the third level, and being separated from the first conductive structure in the first direction.