US 12,073,166 B2
Method and structure for mandrel patterning
Yung Feng Chang, Hsinchu (TW); Pi-Yun Sun, Hsinchu (TW); Tung-Heng Hsieh, Hsinchu County (TW); Yu-Jung Chang, Hsinchu County (TW); and Bao-Ru Young, Hsinchu County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Dec. 30, 2021, as Appl. No. 17/566,472.
Claims priority of provisional application 63/214,889, filed on Jun. 25, 2021.
Prior Publication US 2022/0414309 A1, Dec. 29, 2022
Int. Cl. G06F 30/392 (2020.01)
CPC G06F 30/392 (2020.01) 20 Claims
OG exemplary drawing
 
1. A method, comprising:
receiving an integrated circuit (IC) design layout including a layout block, wherein the layout block has a corner;
adding first patterns along a first edge of the corner;
adding second patterns along a second edge of the corner;
moving a first column of the first patterns closest to the second edge toward the second edge;
moving a second column of second patterns closest to the second edge toward the second edge;
extending lengths of the first and second patterns in the first and second columns; and
outputting a pattern layout in a computer-readable format, wherein the pattern layout includes the first and the second patterns.