US 12,072,747 B2
Power over cable via stub effect mitigation method and system for camera interface of high speed printed circuit board for autonomous vehicles
Zhenwei Yu, Sunnyvale, CA (US); and Yun Ji, Sunnyvale, CA (US)
Assigned to BAIDU USA LLC, Sunnyvale, CA (US)
Filed by Baidu USA LLC, Sunnyvale, CA (US)
Filed on Sep. 20, 2022, as Appl. No. 17/948,925.
Prior Publication US 2024/0094791 A1, Mar. 21, 2024
Int. Cl. G06F 1/26 (2006.01); G05D 1/00 (2006.01)
CPC G06F 1/266 (2013.01) [G05D 1/0246 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for routing a conductive path within a printed circuit board (PCB), comprising:
routing a first segment of a conductive path from a first location at a first signal layer to a second location at the first signal layer of a printed circuit board (PCB) utilizing a first segment of a transmission line, the PCB having a first surface and a second surface that is opposite the first surface;
routing a second segment of the conductive path from the second location at the first signal layer to a power-over-cable circuit disposed on the first surface of the PCB utilizing a first signal via, the first signal via extending from the first layer to the first surface of a substrate;
routing a third segment of the conductive path from the power-over-cable circuit to a third location at the first signal layer utilizing a second signal via, the second signal via extending from the first layer to the first surface of the substrate; and
routing a fourth segment of the conductive path from the third location at the first signal layer to a fourth location at the first signal layer utilizing a second segment of the transmission line, wherein the conductive path is coupled to an image sensor used to perceive an environment of an autonomous driving vehicle (ADV).