US 12,072,745 B2
Method and system to extend CMOS battery life
Derric Christopher Hobbs, Round Rock, TX (US); and Eric N. Sendelbach, Austin, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on Oct. 15, 2021, as Appl. No. 17/502,555.
Prior Publication US 2023/0121936 A1, Apr. 20, 2023
Int. Cl. G06F 1/3287 (2019.01); G06F 1/14 (2006.01); G06F 1/18 (2006.01); G06F 1/26 (2006.01)
CPC G06F 1/26 (2013.01) [G06F 1/14 (2013.01); G06F 1/183 (2013.01); G06F 1/3287 (2013.01); G06F 2221/034 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An information handling system comprising:
a housing;
a main board coupled to the housing by a coupling device;
a processor coupled to the main board and operable to execute instructions that process information;
a memory coupled to the main board and interfaced with the processor, the memory operable to store the instructions and information;
an embedded controller coupled to the main board and operable to manage application of power at the main board;
a CMOS coupled to the main board and interfaced with the embedded controller, the CMOS operable to manage a real time clock when power is absent from the main board;
a CMOS battery coupled to the main board and having a positive terminal interfaced with the CMOS through the main board to power the CMOS, the CMOS battery having a ground terminal interfaced with the main board with ground to the CMOS open in the main board between the ground terminal and CMOS when the coupling device is absent, the coupling device interfacing the ground terminal to the CMOS through the main board when the coupling device couples the main board to the housing;
a bi-stable relay disposed between a positive terminal of the CMOS battery and the CMOS and interfaced with the embedded controller, the bi-stable relay configured in an open position before the main board couples to housing; and
a split ground pad coupled to the main board at an opening of the main board configured to accept the coupling device;
wherein the coupling device comprises a metal screw that passes through the opening and presses against the split ground pad to complete the CMOS battery ground interface.