US 12,072,632 B2
Method for fabricating a metal decoration on a dial and dial obtained by this method
Elias Laforge, Neuchatel (CH); Alexandre Haemmerli, Neuchatel (CH); Benjamin Tixier, Neuchatel (CH); Pascal Grossenbacher, Neuchatel (CH); and Pierry Vuille, Les Emibois (CH)
Assigned to The Swatch Group Research and Development Ltd, Marin (CH)
Filed by The Swatch Group Research and Development Ltd, Marin (CH)
Filed on Feb. 11, 2019, as Appl. No. 16/271,912.
Claims priority of application No. 18161026 (EP), filed on Mar. 9, 2018.
Prior Publication US 2019/0278182 A1, Sep. 12, 2019
Int. Cl. G03F 7/20 (2006.01); B44C 1/00 (2006.01); C23F 1/02 (2006.01); C25D 5/02 (2006.01); C25D 7/00 (2006.01); G03F 7/16 (2006.01); G04B 37/22 (2006.01)
CPC G03F 7/20 (2013.01) [B44C 1/00 (2013.01); C25D 7/005 (2013.01); G03F 7/16 (2013.01); G04B 37/22 (2013.01); C23F 1/02 (2013.01); C25D 5/022 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method for fabricating at least one metal decoration on a substrate made of insulating material having a domed surface, the method comprising:
(a) depositing onto a ceramic, sapphire, mother of pearl, glass, quartz, diamond, mineral material, polymer, composite, or enamel substrate a first adhesion layer, comprising Ti, Ta, Cr, or Th, then, onto the first adhesion layer, a second electrically conductive layer, comprising Au, Pt, Ag, Cr, Pd, TiN, CrN, ZrN, or Ni, by vapor phase deposition;
(b) depositing a third adhesion layer, comprising SixNy, onto the second electrically conductive layer;
(c) applying a photosensitive resin layer on the third adhesion layer;
(d) irradiating the resin layer through a mask defining a contour of desired decoration(s);
(e) dissolving non-irradiated areas of the photosensitive resin layer to reveal, in places, the third adhesion layer where the decoration(s) are located;
(f) removing the third adhesion layer where the decoration(s) are located, to reveal the second conductive layer;
(g) electrodepositing a first metal or metal alloy, starting from the second electrically conductive surface, to form at least one unit that substantially reaches an upper surface of the photosensitive resin;
(h) plasma etching to thereby remove the remaining resin layer; and
(i) wet etching to thereby remove the first adhesion layer, second electrically conductive layer, and third adhesion layer.