US 12,072,534 B2
Fiber to chip coupler and method of using
Sui-Ying Hsu, Hsinchu (TW); Yuehying Lee, Hsinchu (TW); Chien-Ying Wu, Hsinchu (TW); Chen-Hao Huang, Hsinchu (TW); Chien-Chang Lee, Hsinchu (TW); and Chia-Ping Lai, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsninchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Aug. 27, 2021, as Appl. No. 17/459,917.
Prior Publication US 2023/0064550 A1, Mar. 2, 2023
Int. Cl. G02B 6/34 (2006.01); G02B 6/30 (2006.01)
CPC G02B 6/34 (2013.01) [G02B 6/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A coupling system comprising:
an optical fiber configured to carry an optical signal; and
a chip in optical communication with the optical fiber, wherein an angle between a longitudinal axis of the optical fiber and a top surface of the chip ranges from about 92-degrees to about 88-degrees, and the chip comprises:
a grating configured to receive the optical signal; and
a waveguide, wherein the grating is configured to receive the optical signal and redirect the optical signal along the waveguide, and the grating is on a light incident side of the waveguide closest to the optical fiber.