CPC G01S 7/4815 (2013.01) [G01S 7/4817 (2013.01); G01S 7/484 (2013.01); G02F 1/292 (2013.01); G02B 2006/12166 (2013.01)] | 15 Claims |
1. A phased array light detection and ranging (LiDAR) transmitting chip of multi-layer materials, comprising: a first material structure layer and an SOI silicon waveguide structure layer, wherein an overlapping region of a rear end of the first material structure layer and a front end of the SOI silicon waveguide structure layer forms a coupling connection structure, and the first material structure layer comprises: an input coupler and a beam splitter;
the input coupler is optically connected to the beam splitter; and the beam splitter is optically connected to the SOI silicon waveguide structure layer through the coupling connection structure;
the input coupler is configured to couple input light to the chip;
the beam splitter is configured to split a light wave coupled to the chip;
the coupling connection structure is configured to couple each of split light waves to a corresponding silicon waveguide in the SOI silicon waveguide structure layer; and
a non-linear refractive index of a first material in the first material structure layer is lower than that of a silicon material.
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