US 12,072,399 B2
Magnetic sensor
Kentaro Harada, Tokyo (JP); Tsuyoshi Umehara, Tokyo (JP); and Kenichi Takano, Tokyo (JP)
Assigned to TDK Corporation, Tokyo (JP)
Filed by TDK Corporation, Tokyo (JP)
Filed on Jul. 31, 2023, as Appl. No. 18/362,011.
Application 18/362,011 is a continuation of application No. 17/852,956, filed on Jun. 29, 2022, granted, now 11,762,044.
Application 17/852,956 is a continuation of application No. 17/036,104, filed on Sep. 29, 2020, granted, now 11,408,950, issued on Aug. 9, 2022.
Claims priority of application No. 2019-193474 (JP), filed on Oct. 24, 2019.
Prior Publication US 2023/0384401 A1, Nov. 30, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 33/09 (2006.01)
CPC G01R 33/098 (2013.01) [G01R 33/091 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A magnetic sensor comprising:
a first soft magnetic layer,
a pair of second soft magnetic layers that is positioned at a location that is different from the first soft magnetic layer in a thickness direction of the first soft magnetic layer, wherein the thickness direction is a direction in which the first soft magnetic layer has a thinnest thickness,
a magnetic field detecting element that is positioned between the first soft magnetic layer and the second soft magnetic layers in the thickness direction, wherein the magnetic field detecting element has a magnetic field detecting direction that is parallel to a direction in which the pair of the second soft magnetic layers is arranged, wherein
as viewed in the thickness direction, the second soft magnetic layers are positioned on both sides of a center of the first soft magnetic layer, and
as viewed in the thickness direction, the entirety of the magnetic field detecting element overlaps the first soft magnetic layer and is positioned between the pair of second soft magnetic layers.