US 12,072,370 B2
Semiconductor package test apparatus and method
Sung Ok Kim, Asan-si (KR); Min Woo Kim, Cheonan-si (KR); Ho Gyung Kim, Cheonan-si (KR); Dahm Yu, Asan-si (KR); and Jae Hyun Kim, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 19, 2021, as Appl. No. 17/406,553.
Claims priority of application No. 10-2020-0104560 (KR), filed on Aug. 20, 2020.
Prior Publication US 2022/0057444 A1, Feb. 24, 2022
Int. Cl. G01R 31/27 (2006.01); G01R 31/28 (2006.01); G01R 31/3183 (2006.01)
CPC G01R 31/275 (2013.01) [G01R 31/2862 (2013.01); G01R 31/2872 (2013.01); G01R 31/2889 (2013.01); G01R 31/318314 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor package test apparatus comprising:
a test board including a plurality of sensors;
a chamber into which the test board is configured to be loaded; and
a controller configured to control a temperature of the chamber,
wherein the controller is configured to adjust the temperature based on output from the plurality of sensors,
wherein the plurality of sensors include a temperature sensor and a humidity sensor, and
wherein the controller is configured to calculate a dew point of the test board using a temperature of the test board and a humidity of the test board, the temperature of the test board measured by the temperature sensor and the humidity of the test board measured by the humidity sensor.