US 12,072,349 B2
Method of manufacturing low heat-resistant sensor
Hisataka Satoh, Gojo (JP); and Tetsuya Komeda, Gojo (JP)
Assigned to VALQUA, LTD., Tokyo (JP)
Appl. No. 17/769,048
Filed by Valqua, Ltd., Tokyo (JP)
PCT Filed Sep. 28, 2020, PCT No. PCT/JP2020/036580
§ 371(c)(1), (2) Date Apr. 14, 2022,
PCT Pub. No. WO2021/075249, PCT Pub. Date Apr. 22, 2021.
Claims priority of application No. 2019-190083 (JP), filed on Oct. 17, 2019.
Prior Publication US 2024/0103034 A1, Mar. 28, 2024
Int. Cl. G01F 1/00 (2022.01); G01P 1/02 (2006.01); G01P 15/08 (2006.01)
CPC G01P 15/0802 (2013.01) [G01P 1/023 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A method of manufacturing a low heat-resistant sensor, the method comprising:
a step of disposing a sensor unit in a recessed portion of a container composed of fluorine resin, inserting a cable into a through-hole in communication with the recessed portion, and electrically connecting the sensor unit that is disposed in the recessed portion and the cable to each other;
a step of disposing a plate composed of fluorine resin such that the plate covers an opening of the recessed portion and capping the recessed portion;
a step of covering the cable by using a tube composed of fluorine resin;
a step of disposing a frame body composed of fluorine resin such that the frame body surrounds a perimeter of the plate;
a step of thermally bonding the frame body, the container, and the plate to each other; and
a step of thermally bonding the container and the tube to each other.