US 12,072,267 B2
Method and hardware for post maintenance vacuum recovery system
Martin A. Hilkene, Santa Clara, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 27, 2021, as Appl. No. 17/459,545.
Claims priority of provisional application 63/072,860, filed on Aug. 31, 2020.
Prior Publication US 2022/0065735 A1, Mar. 3, 2022
Int. Cl. G01M 3/34 (2006.01); G05B 15/02 (2006.01); C30B 25/16 (2006.01); H01J 37/32 (2006.01)
CPC G01M 3/34 (2013.01) [G05B 15/02 (2013.01); C30B 25/16 (2013.01); H01J 37/32972 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for verifying vacuum chamber leak integrity, the method comprising:
causing, by a computing system, a measurement cycle comprising:
causing a pump to pump down pressure of a semiconductor processing chamber for a set duration of time, independent of a target pressure;
responsive to completion of the set duration of time, causing an isolation valve to isolate the semiconductor processing chamber;
receiving sensor data from an optical emission sensor; and
analyzing the sensor data to determine whether the sensor data satisfies one or more sensor data criteria;
causing, by the computing system, one or more repetitions of the measurement cycle until the sensor data meets the one or more sensor data criteria; and
analyzing the sensor data that meets the sensor data criteria to determine a vacuum chamber leak rate.