US 12,072,256 B2
Pressure sensor device
Masanori Kobayashi, Tokyo (JP); Ken Unno, Tokyo (JP); Tetsuya Sasahara, Tokyo (JP); and Kohei Nawaoka, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Appl. No. 17/639,167
Filed by TDK CORPORATION, Tokyo (JP)
PCT Filed Aug. 28, 2020, PCT No. PCT/JP2020/032661
§ 371(c)(1), (2) Date Feb. 28, 2022,
PCT Pub. No. WO2021/049328, PCT Pub. Date Mar. 18, 2021.
Claims priority of application No. 2019-164000 (JP), filed on Sep. 9, 2019.
Prior Publication US 2022/0291068 A1, Sep. 15, 2022
Int. Cl. G01L 19/14 (2006.01); G01L 9/00 (2006.01); G01L 9/04 (2006.01)
CPC G01L 19/147 (2013.01) [G01L 9/04 (2013.01); G01L 9/0047 (2013.01); G01L 9/0048 (2013.01); G01L 9/0055 (2013.01); G01L 19/143 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A pressure sensor device, comprising:
a metal plate configured to be deformed in accordance with a pressure;
an insulating film provided on a first surface of the metal plate so as to form a covered region where the first surface is covered and an exposed region where the first surface is exposed; and
a pressure detection circuit formed on the insulating film so as to be insulated from the first surface by the insulating film, wherein
the pressure detection circuit includes a strain gauge configured to detect a deformation occurring in the metal plate,
a second surface of the metal plate opposite the first surface of the metal plate includes a welded portion to be welded to a housing, and
at least a part of the welded portion overlaps with the exposed region when seen from a direction orthogonal to the first surface.