US 12,072,228 B2
Vibration sensors
Yongshuai Yuan, Shenzhen (CN); Wenjun Deng, Shenzhen (CN); Wenbing Zhou, Shenzhen (CN); Yujia Huang, Shenzhen (CN); Fengyun Liao, Shenzhen (CN); and Xin Qi, Shenzhen (CN)
Assigned to SHENZHEN SHOKZ CO., LTD., Shenzhen (CN)
Filed by SHENZHEN SHOKZ CO., LTD., Guangdong (CN)
Filed on May 19, 2023, as Appl. No. 18/320,229.
Application 18/320,229 is a continuation of application No. 17/814,533, filed on Jul. 25, 2022, granted, now 11,662,248.
Application 17/814,533 is a continuation of application No. PCT/CN2021/112017, filed on Aug. 11, 2021.
Prior Publication US 2023/0288250 A1, Sep. 14, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G01H 11/06 (2006.01); G01H 11/08 (2006.01); H04R 1/08 (2006.01); H04R 7/04 (2006.01); H04R 7/08 (2006.01)
CPC G01H 11/06 (2013.01) [G01H 11/08 (2013.01); H04R 1/08 (2013.01); H04R 7/04 (2013.01); H04R 7/08 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A vibration sensor, comprising:
an acoustic transducer;
a vibration assembly connected with the acoustic transducer, the vibration assembly being configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal;
the vibration assembly being configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands, wherein the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and resonance frequencies of the one or more groups of vibration diaphragms and mass blocks are less than a resonance frequency of the vibration sensor.