	US 12,071,700 B2
	Electroplating with a polycarboxylate ether supressor
Tobias Urban, Ludwigshafen (DE); Paul Klingelhoefer, Ludwigshafen (DE); Sophie Maitro-Vogel, Ludwigshafen (DE); Yvonne Schriefers, Ludwigshafen (DE); Frank Richter, Ludwigshafen (DE); and Manfred Bichler, Trostberg (DE)
Assigned to BASF SE, Ludwigshafen (DE)
Appl. No. 17/909,030
Filed by BASF SE, Ludwigshafen (DE)
PCT Filed Mar. 3, 2021, PCT No. PCT/EP2021/055364 § 371(c)(1), (2) Date Sep. 2, 2022, PCT Pub. No. WO2021/175935, PCT Pub. Date Sep. 10, 2021.
Claims priority of application No. 20161357 (EP), filed on Mar. 6, 2020; and application No. 20179012 (EP), filed on Jun. 9, 2020.
Prior Publication US 2023/0091747 A1, Mar. 23, 2023
Int. Cl. C25D 3/02 (2006.01); C25D 3/38 (2006.01); C25D 5/00 (2006.01); C25D 21/12 (2006.01)

CPC C25D 21/12 (2013.01) [C25D 3/38 (2013.01)]

15 Claims

1. A process for depositing a metal layer on a substrate comprising the steps of:

a) contacting the substrate with a metal plating bath comprising a metal ion source and a suppressor, and

b) applying a current density to the substrate, thereby depositing the metal layer on the substrate,

wherein the suppressor is a polycarboxylate ether obtained by polymerizing a mixture of monomers to form a copolymer, comprising

(i) at least one ethylenically unsaturated monomer (I) which comprises at least one radical from carboxylic acid, carboxylic salt, carboxylic ester, carboxylic amide, carboxylic anhydride, and/or carboxylic imide; and

(ii) at least one ethylenically unsaturated monomer (II) having a polyalkylene oxide radical.