CPC C23C 14/50 (2013.01) [H01L 21/683 (2013.01); Y10T 29/5397 (2015.01)] | 19 Claims |
1. A clamping device, configured to clamp a substrate, comprising:
a clamping plate; and
a flattening mechanism comprising at least one adjusting member, the at least one adjusting member being disposed on the clamping plate and being configured to exert a force to the clamping plate to flatten the clamping plate;
wherein the adjusting member comprises:
a connecting portion connected to the clamping plate; and
at least one adjusting portion connected to the connecting portion, the at least one adjusting portion passing through the connecting portion and configured to exert the force to the clamping plate.
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