US 12,071,557 B2
Conductive laminate and manufacturing method of conductive laminate
Kotaro Maeda, Kanagawa (JP); and Norihide Shimohara, Kanagawa (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Mar. 8, 2023, as Appl. No. 18/180,135.
Application 18/180,135 is a continuation of application No. PCT/JP2021/035590, filed on Sep. 28, 2021.
Claims priority of application No. 2020-165596 (JP), filed on Sep. 30, 2020.
Prior Publication US 2023/0220230 A1, Jul. 13, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 3/00 (2006.01); B41M 5/00 (2006.01); C09D 11/037 (2014.01); C09D 11/322 (2014.01); C09D 11/52 (2014.01); H01B 5/14 (2006.01); H01B 13/00 (2006.01)
CPC C09D 11/52 (2013.01) [B41M 5/0017 (2013.01); C09D 11/037 (2013.01); C09D 11/322 (2013.01); H01B 5/14 (2013.01); H01B 13/0016 (2013.01)] 18 Claims
 
1. A conductive laminate comprising:
a base material; and
a conductive ink film provided on the base material, wherein the conductive ink film comprises a metal salt or a metal complex;
the conductive ink film has a first main surface and a second main surface, wherein the first main surface is closer to the base material than the second main surface, and the second main surface is farer from the base material than the first main surface,
a region that extends from a position being away from the first main surface toward the second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface has a first void ratio of 15% to 50%, and a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film has a second void ratio which is smaller than the first void ratio.