US 12,071,341 B2
Microstructure and method of producing a microstructure
Peter Heeb, Balgach (CH); Michelle Müller, Zufikon (CH); and Goran Stojanovic, Eindhoven (NL)
Assigned to AMS INTERNATIONAL AG, Jona (CH)
Appl. No. 17/642,449
Filed by ams International AG, Jona (CH)
PCT Filed Sep. 1, 2020, PCT No. PCT/EP2020/074347
§ 371(c)(1), (2) Date Mar. 11, 2022,
PCT Pub. No. WO2021/047959, PCT Pub. Date Mar. 18, 2021.
Claims priority of application No. 19197364 (EP), filed on Sep. 13, 2019.
Prior Publication US 2022/0298006 A1, Sep. 22, 2022
Int. Cl. B81B 3/00 (2006.01); B81C 1/00 (2006.01)
CPC B81C 1/00158 (2013.01) [B81B 3/0072 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/047 (2013.01); B81B 2203/0127 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A microstructure for use in a microelectromechanical device comprising a substrate having a top surface and a rear surface and a thin-film structure arranged at the top surface of the substrate, the thin-film structure comprising:
a raised portion spaced from the substrate wherein the raised portion of the thin-film structure is a movable part of the microstructure,
a lower portion of the thin-film structure, which is in mechanical contact with the substrate,
at least one protruding portion being hollow and having at least one sidewall and a bottom part and the protruding portion mechanically connecting the raised portion to the substrate via the bottom part, wherein the at least one protruding portion forms a hollow profile enclosing a volume and being open at its top side, the top side facing away from the substrate, and
at least one further sidewall of the thin-film structure at a distance to the at least one protruding portion, wherein the further sidewall mechanically connects the lower portion with the raised portion of the thin-film structure.