US 12,071,339 B2
Micro-acoustic wafer-level package and method of manufacture
Manuel Hofer, Munich (DE); Rodrigo Pacher Fernandes, Munich (DE); Stefan Leopold Hatzl, Munich (DE); Josef Ehgartner, Munich (DE); and Peter Bainschab, Munich (DE)
Assigned to RF360 Singapore Pte. Ltd., Singapore (SG)
Appl. No. 17/294,615
Filed by RF360 SINGAPORE PTE. LTD., Republic Plaza (SG)
PCT Filed Dec. 13, 2019, PCT No. PCT/EP2019/085083
§ 371(c)(1), (2) Date May 17, 2021,
PCT Pub. No. WO2020/126907, PCT Pub. Date Jun. 25, 2020.
Claims priority of application No. 10 2018 132 644.0 (DE), filed on Dec. 18, 2018.
Prior Publication US 2021/0395076 A1, Dec. 23, 2021
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01); H03H 3/007 (2006.01); H03H 9/17 (2006.01)
CPC B81B 7/0051 (2013.01) [B81C 1/00269 (2013.01); H03H 3/007 (2013.01); H03H 9/171 (2013.01); B81B 2201/0271 (2013.01); B81B 2207/053 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/037 (2013.01)] 20 Claims
OG exemplary drawing
 
16. A device, comprising:
a base wafer comprising a top surface, wherein the top surface comprises an array of device areas assigned to respective micro-acoustic devices, and wherein the respective micro-acoustic devices form a frame structure on the top surface that encloses corresponding device areas of the array of device areas with respective electric structures; and
a cap wafer having a coefficient of thermal expansion (CTE) adapted to a CTE of the base wafer, wherein the cap wafer has an underside coated with a UV-curable polymer coating, and wherein the cap wafer is wafer-bonded to the frame structure via the UV-curable polymer coating.