US 12,070,950 B2
Liquid ejecting apparatus and cleaning device
Shigenori Nakagawa, Kamilina-gun (JP); and Keiji Matsumoto, Matsumoto (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on May 5, 2023, as Appl. No. 18/313,196.
Application 18/313,196 is a continuation of application No. 17/331,224, filed on May 26, 2021, granted, now 11,679,590.
Application 17/331,224 is a continuation of application No. 16/795,368, filed on Feb. 19, 2020, granted, now 11,052,661, issued on Jul. 6, 2021.
Application 16/795,368 is a continuation of application No. 16/419,269, filed on May 22, 2019, granted, now 10,766,262, issued on Sep. 8, 2020.
Application 16/419,269 is a continuation of application No. 15/860,448, filed on Jan. 2, 2018, granted, now 10,357,973, issued on Jul. 23, 2019.
Application 15/860,448 is a continuation of application No. 15/285,293, filed on Oct. 4, 2016, granted, now 9,889,669, issued on Feb. 13, 2018.
Claims priority of application No. 2015-197401 (JP), filed on Oct. 5, 2015.
Prior Publication US 2023/0271420 A1, Aug. 31, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B41J 2/165 (2006.01)
CPC B41J 2/16535 (2013.01) [B41J 2/16538 (2013.01); B41J 2/16508 (2013.01); B41J 2002/1655 (2013.01); B41J 2002/16558 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A liquid ejecting apparatus comprising:
a liquid ejecting head configured to eject liquid from a nozzle disposed on a nozzle surface;
a first wiping portion that has flexibility and configured to wipe the nozzle surface;
a second wiping portion provided separately from the first wiping portion and configured to absorb the liquid adhering to the nozzle surface; and
a control portion configured to control the first wiping portion and the second wiping portion, wherein
the control portion is configured to perform
a first maintenance operation that wipes the nozzle surface by the first wiping portion,
a cleaning operation for cleaning the first wiping portion by contacting the first wiping portion and the second wiping portion, and
a second maintenance operation that wipes the nozzle surface by the second wiping portion.