US 12,070,949 B2
Manufacturing method of liquid ejecting head and manufacturing method of flow path component
Naohiro Nakagawa, Matsumoto (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Mar. 16, 2021, as Appl. No. 17/203,192.
Claims priority of application No. 2020-048805 (JP), filed on Mar. 19, 2020.
Prior Publication US 2021/0291524 A1, Sep. 23, 2021
Int. Cl. H01L 21/306 (2006.01); B41J 2/16 (2006.01)
CPC B41J 2/1623 (2013.01) [B41J 2/1607 (2013.01); B41J 2/1626 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A manufacturing method of a liquid ejecting head which has a nozzle and a liquid flow path having a pressure chamber to which a pressure for ejecting droplets from the nozzle is applied, and where a first substrate, in which a first liquid flow path is to be formed, and a second substrate, in which a second liquid flow path is to be formed, are bonded to each other, the method comprising:
directly bonding the first substrate and a first surface of the second substrate without using an adhesive;
thinning the second substrate so as to be thinner at a second surface, which is opposite the first surface, than the first substrate after directly bonding the first substrate and the second substrate; and
bonding the second surface of the second substrate and a nozzle substrate having the nozzle.