US 12,070,820 B2
Processing apparatus and processing method
Hayato Tanoue, Kumamoto (JP); Yohei Yamashita, Kumamoto (JP); and Hirotoshi Mori, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Appl. No. 17/627,707
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Jul. 9, 2020, PCT No. PCT/JP2020/026878
§ 371(c)(1), (2) Date Jan. 17, 2022,
PCT Pub. No. WO2021/010284, PCT Pub. Date Jan. 21, 2021.
Claims priority of application No. 2019-133087 (JP), filed on Jul. 18, 2019.
Prior Publication US 2022/0250191 A1, Aug. 11, 2022
Int. Cl. B23K 26/53 (2014.01); B23K 26/062 (2014.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01)
CPC B23K 26/53 (2015.10) [B23K 26/062 (2015.10); H01L 21/304 (2013.01); H01L 21/67092 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A processing apparatus configured to process a processing target object, comprising:
a holder configured to hold the processing target object;
a modifying device configured to form multiple condensing points along a plane direction of the processing target object by radiating laser light to an inside of the processing target object;
a moving mechanism configured to move the holder and the modifying device in a horizontal direction relative to each other;
a rotating mechanism configured to rotate the holder and the modifying device relative to each other; and
a controller configured to control an operation of forming the condensing points in the processing target object,
wherein in forming the condensing points by radiating the laser light to the inside of the processing target object periodically from the modifying device while rotating the processing target object held by the holder relative to the modifying device by the rotating mechanism and, also, by moving the modifying device in a diametrical direction relative to the holder by the moving mechanism, the controller controls a number and an arrangement of the condensing points, which are simultaneously formed at different positions in the plane direction of the processing target object, based on a relative rotation number of the processing target object and a radiation pitch of the laser light.