US 12,070,812 B2
Method for connection by brazing enabling improved fatigue resistance of brazed joints
Eric Cadalen, Le Plessis-Robinson (FR); and Mikaël Saturnin, Le Plessis-Robinson (FR)
Assigned to MBDA FRANCE, Le Plessis-Robinson (FR)
Appl. No. 17/291,262
Filed by MBDA FRANCE, Le Plessis-Robinson (FR)
PCT Filed Oct. 16, 2019, PCT No. PCT/FR2019/052448
§ 371(c)(1), (2) Date May 4, 2021,
PCT Pub. No. WO2020/094936, PCT Pub. Date May 14, 2020.
Claims priority of application No. 18/01162 (FR), filed on Nov. 6, 2018.
Prior Publication US 2022/0001475 A1, Jan. 6, 2022
Int. Cl. B23K 1/00 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01); B23K 103/08 (2006.01)
CPC B23K 1/0016 (2013.01) [H05K 3/34 (2013.01); B23K 2101/42 (2018.08); B23K 2103/08 (2018.08)] 18 Claims
OG exemplary drawing
 
1. A method for connection, by brazing, between at least two elements, said two elements corresponding respectively to a printed circuit and to an electronic component, the method characterised in that it comprises at least the following sequence of steps:
a) a step of forming a plurality of stacks of stud bumps, said plurality of stacks of stud bumps being formed on a face of a first element of said two elements, said plurality of stacks of stud bumps each comprising the same given number of bumps;
b) a step of depositing a brazing product on the first element provided with the plurality of stacks of stud bumps or on a second element of the said two elements;
c) a step of arranging the second element on said first element; and
d) a step of remelting, by brazing, the brazing product thus formed in the arranging step to create at least one brazed joint between the first element and the second element, in order to obtain an electronic device,
wherein the brazing product directly contacts the face of the first element after the remelting step, and
wherein the forming step consists, for each stack of stud bumps of the plurality of stacks of stud bumps, in implementing, in succession, a predetermined number of forming sub-steps, each of said forming sub-steps consisting in forming a bump, the bumps of the stack of stud bumps being formed in succession by being stacked on top of each other.