US 12,070,800 B2
Electronic component and method for manufacturing electronic component
Yoshinori Ejiri, Tokyo (JP); Shinichirou Sukata, Tokyo (JP); Masaya Toba, Tokyo (JP); Hideo Nakako, Tokyo (JP); Yuki Kawana, Tokyo (JP); Kosuke Urashima, Tokyo (JP); Motoki Yonekura, Tokyo (JP); Takaaki Nohdoh, Tokyo (JP); Yoshiaki Kurihara, Tokyo (JP); Hiroshi Masuda, Tokyo (JP); and Keita Sone, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/274,788
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
PCT Filed Sep. 5, 2019, PCT No. PCT/JP2019/035039
§ 371(c)(1), (2) Date Mar. 10, 2021,
PCT Pub. No. WO2020/054581, PCT Pub. Date Mar. 19, 2020.
Claims priority of application No. 2018-172332 (JP), filed on Sep. 14, 2018.
Prior Publication US 2022/0053647 A1, Feb. 17, 2022
Int. Cl. B22F 7/08 (2006.01); B22F 1/052 (2022.01); H05K 1/18 (2006.01); H05K 3/12 (2006.01); H05K 3/34 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01)
CPC B22F 7/08 (2013.01) [B22F 1/052 (2022.01); H05K 1/181 (2013.01); H05K 3/1283 (2013.01); H05K 3/3463 (2013.01); H05K 3/3485 (2020.08); H05K 1/032 (2013.01); H05K 1/0333 (2013.01); H05K 1/09 (2013.01); H05K 2201/0141 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for manufacturing an electronic component, the method comprising:
a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer;
a second step of sintering the metal particles to form a metal wiring;
a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer;
a fourth step of disposing an electronic element on the solder paste layer; and
a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer, wherein the solder layer covers a side surface of the metal wiring,
wherein the metal particles comprises first copper particles having a particle diameter of 2.0 μm or more and second copper particles having a particle diameter of 0.8 μm or less; and
wherein the polymer compact is made of a liquid crystal polymer or polyphenylene sulfide.