CPC B22F 7/08 (2013.01) [B22F 1/052 (2022.01); H05K 1/181 (2013.01); H05K 3/1283 (2013.01); H05K 3/3463 (2013.01); H05K 3/3485 (2020.08); H05K 1/032 (2013.01); H05K 1/0333 (2013.01); H05K 1/09 (2013.01); H05K 2201/0141 (2013.01)] | 6 Claims |
1. A method for manufacturing an electronic component, the method comprising:
a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer;
a second step of sintering the metal particles to form a metal wiring;
a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer;
a fourth step of disposing an electronic element on the solder paste layer; and
a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer, wherein the solder layer covers a side surface of the metal wiring,
wherein the metal particles comprises first copper particles having a particle diameter of 2.0 μm or more and second copper particles having a particle diameter of 0.8 μm or less; and
wherein the polymer compact is made of a liquid crystal polymer or polyphenylene sulfide.
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