US 12,070,797 B1
Direct metal deposition of electronic device components
Anthony D. Prescenzi, Santa Clara, CA (US); Abhijeet Misra, Sunnyvale, CA (US); Adam T. Clavelle, San Francisco, CA (US); Eric W. Hamann, Santa Clara, CA (US); Isabel Yang, San Jose, CA (US); Brian M. Gable, San Jose, CA (US); and James A. Yurko, Saratoga, CA (US)
Assigned to APPLE INC., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Sep. 15, 2021, as Appl. No. 17/447,790.
Application 17/447,790 is a continuation of application No. 17/138,488, filed on Dec. 30, 2020, abandoned.
Claims priority of provisional application 63/027,801, filed on May 20, 2020.
Int. Cl. B33Y 80/00 (2015.01); B22F 10/25 (2021.01); B22F 10/66 (2021.01); B32B 15/01 (2006.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01)
CPC B22F 10/25 (2021.01) [B22F 10/66 (2021.01); B32B 15/01 (2013.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 80/00 (2014.12)] 8 Claims
OG exemplary drawing
 
1. A structure, comprising:
a metallic three-dimensional (3D) printed elongated body defining a continuous orifice;
wherein:
the elongated body comprises a plurality of sectionable elements, each sectionable element of the plurality of sectionable elements including a section location defining where each sectionable element is configured to be divisible from an adjacent sectionable element;
each sectionable element defines the continuous orifice at the sectionable location; and
the elongated body comprises a first metal and a second metal, the second metal different from the first metal.