US 12,070,779 B2
Method of manufacturing semiconductor wafer and cleaning scrubber
Pei-Yi Su, Taichung (TW); and Cheng-Chieh Chen, Tainan (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Apr. 22, 2021, as Appl. No. 17/237,182.
Claims priority of application No. 109113617 (TW), filed on Apr. 23, 2020.
Prior Publication US 2021/0331211 A1, Oct. 28, 2021
Int. Cl. B08B 1/10 (2024.01); G03F 7/20 (2006.01)
CPC B08B 1/10 (2024.01) [G03F 7/2004 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
performing a photolithography process on a first wafer held on a plurality of burls of a supporting surface of a wafer table;
moving the first wafer away from the wafer table; and
cleaning the wafer table by using a cleaning scrubber, wherein the cleaning scrubber comprises a major surface and a plurality of microstructures extending from the major surface, wherein the major surface of the cleaning scrubber comprises an inner annular region and an outer annular region around the inner annular region, wherein first ones of the plurality of microstructures within the outer annular region have a height different from a height of second ones of the plurality of microstructures within the inner annular region, and the plurality of microstructures are gradually tapered from a first width to a second width in a direction away from the major surface, the second width is less than a width of a plurality of trenches in the supporting surface of a wafer table, wherein the plurality of microstructures remain protruding from the major surface during cleaning the wafer table, wherein the wafer table is cleaned by horizontally moving the cleaning scrubber when the cleaning scrubber comes in contact with the wafer table, and the horizontal movement of the cleaning scrubber causes contaminant particles to fall from top surfaces of the burls to a trench between the burls.