US 12,070,611 B2
Stimulation system with monolithic-lead component connected to skull mount package
Shivkumar Sabesan, Campbell, CA (US); Bo Lu, South San Francisco, CA (US); and Annapurna Karicherla, South San Francisco, CA (US)
Assigned to VERILY LIFE SCIENCES LLC, South San Francisco, CA (US)
Appl. No. 17/276,439
Filed by Verily Life Sciences LLC, South San Francisco, CA (US)
PCT Filed Sep. 13, 2019, PCT No. PCT/US2019/051168
§ 371(c)(1), (2) Date Dec. 16, 2021,
PCT Pub. No. WO2020/060882, PCT Pub. Date Mar. 26, 2020.
Claims priority of provisional application 62/732,671, filed on Sep. 18, 2018.
Prior Publication US 2022/0126106 A1, Apr. 28, 2022
Int. Cl. A61N 1/375 (2006.01); A61N 1/05 (2006.01); A61N 1/36 (2006.01)
CPC A61N 1/37514 (2017.08) [A61N 1/0534 (2013.01); A61N 1/0539 (2013.01); A61N 1/36125 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A stimulation system comprising:
one or more stimulating components, wherein each of the one or more stimulating components includes:
one or more electrodes; and
one or more leads, wherein each lead of the one or more leads is connected at a first end of the lead to an electrode of the one or more electrodes and is connected at a second end of the lead to a bonding pad of one or more first bonding pads,
a cylindrical substrate, wherein the cylindrical substrate forms a hollow cylinder, and wherein each of the one or more stimulating components is secured to an outer surface of the cylindrical substrate along a length of the one or more leads; and
a skull-mount package that includes:
electronics that identify stimulation parameters; and
one or more second bonding pads, wherein a bonding pad of the one or more first bonding pads of each lead of the one or more leads is directly electrically and physically connected to a second bonding pad of the one or more second bonding pads.