US D997,123 S
Headphone headband support
Nonomi Shiwaku, Tokyo (JP); and Yutaro Kumagai, Kanagawa (JP)
Assigned to Audio-Technica Corporation, Tokyo (JP)
Filed by Audio-Technica Corporation, Tokyo (JP)
Filed on Dec. 13, 2021, as Appl. No. 29/790,735.
Claims priority of application No. 2021-015845 (JP), filed on Jul. 20, 2021.
Term of patent 15 Years
LOC (14) Cl. 14 - 01
U.S. Cl. D14—205
OG exemplary drawing
 
The ornamental design for headphone headband support, as shown and described.