US D997,122 S
Speaker pattern for a headphone
Nonomi Shiwaku, Tokyo (JP); and Yutaro Kumagai, Kanagawa (JP)
Assigned to Audio-Technica Corporation, Tokyo (JP)
Filed by Audio-Technica Corporation, Tokyo (JP)
Filed on Nov. 8, 2021, as Appl. No. 29/790,126.
Claims priority of application No. 2021-012949 (JP), filed on Jun. 16, 2021.
Term of patent 15 Years
LOC (14) Cl. 14 - 01
U.S. Cl. D14—205  [D14/219]
OG exemplary drawing
 
The ornamental design for speaker pattern for a headphone, as shown and described.