US 11,744,033 B2
Storage device, latch assembly and storage device assembly comprising the same
Sung Chui Hur, Yongin-si (KR); Bum Jun Kim, Seoul (KR); Jung Soo Kim, Yongin-si (KR); and Young Seok Hong, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 12, 2021, as Appl. No. 17/228,155.
Claims priority of application No. 10-2020-0131583 (KR), filed on Oct. 13, 2020.
Prior Publication US 2022/0117107 A1, Apr. 14, 2022
Int. Cl. H05K 5/00 (2006.01); H05K 7/12 (2006.01); H05K 5/02 (2006.01); H01R 13/627 (2006.01)
CPC H05K 7/12 (2013.01) [H05K 5/026 (2013.01); H05K 5/0217 (2013.01); H01R 13/6273 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A storage device assembly comprising:
a latch assembly; and
a storage device configured to be joined to the latch assembly,
wherein the latch assembly comprises:
a first part,
a second part which extends in a first direction from the first part, and has an upper face that is lower than an upper face of the first part, and
a hook on the upper face of the second part and having elasticity, the hook including a first joining part that is bent away from the upper face of the second part at a first end of the hook, and a second joining part that is bent away from the upper face of the second part at a second end of the hook,
wherein the storage device comprises:
a memory module including a module board, and a memory connector on one side of the module board,
a first enclosure above the memory module, the first enclosure including a first fixing hole configured to accommodate the first joining part, and a second fixing hole configured to accommodate the second joining part in a configuration in which the storage device is joined to the latch assembly, and
a second enclosure below the memory module, and
wherein the first fixing hole and the second fixing hole overlap with the upper face of the second part of the latch assembly.