US 11,744,025 B2
Photosensor comprising a first circuit board within a housing having a through hole with a cable for connecting a second circuit board and method of manufacturing the same
Shunya Takahashi, Kyoto (JP); Hirotaka Nakashima, Fukuchiyama (JP); Jumpei Nakamura, Kyoto (JP); and Tomonari Kawakami, Kyoto (JP)
Assigned to OMRON Corporation, Kyoto (JP)
Appl. No. 17/432,101
Filed by OMRON Corporation, Kyoto (JP)
PCT Filed Mar. 10, 2020, PCT No. PCT/JP2020/010316
§ 371(c)(1), (2) Date Aug. 19, 2021,
PCT Pub. No. WO2020/189416, PCT Pub. Date Sep. 24, 2020.
Claims priority of application No. 2019-048468 (JP), filed on Mar. 15, 2019.
Prior Publication US 2022/0201875 A1, Jun. 23, 2022
Int. Cl. H05K 1/14 (2006.01); H05K 5/00 (2006.01); G01J 1/42 (2006.01)
CPC H05K 5/0026 (2013.01) [G01J 1/42 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A photosensor comprising:
a housing in which a through-hole is formed;
a cable inserted through the through-hole;
a first circuit board housed in the housing and provided with a first connector; and
a second circuit board connecting the cable and the first circuit board,
wherein the second circuit board has a first portion to which the cable is soldered, and a second portion provided with a second connector inserted into the first connector.