US 11,744,022 B2
Method for manufacturing a circuit having a lamination layer using laser direct structuring process
Seung Hyuk Choi, Gyeonggi-do (KR); Hyun Jun Hong, Gyeonggi-do (KR); Tae Wook Kim, Gyeonggi-do (KR); Cheong Ho Ryu, Gyeonggi-do (KR); Young Sang Kim, Gyeonggi-do (KR); and Sung Jun Kim, Gyeonggi-do (KR)
Assigned to Kyocera AVX Components (San Diego), Inc., San Diego, CA (US)
Filed by Kyocera AVX Components (San Diego), Inc., San Diego, CA (US)
Filed on Nov. 29, 2021, as Appl. No. 17/536,429.
Application 16/596,908 is a division of application No. 15/170,943, filed on Jun. 2, 2016, granted, now 10,448,518, issued on Oct. 15, 2019.
Application 17/536,429 is a continuation of application No. 16/596,908, filed on Oct. 9, 2019, granted, now 11,191,165.
Claims priority of application No. 10-2015-0078172 (KR), filed on Jun. 2, 2015.
Prior Publication US 2022/0087029 A1, Mar. 17, 2022
Int. Cl. H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01); H05K 3/28 (2006.01); H05K 3/42 (2006.01)
CPC H05K 3/0026 (2013.01) [H05K 3/0014 (2013.01); H05K 3/185 (2013.01); H05K 3/188 (2013.01); H05K 3/28 (2013.01); H05K 3/423 (2013.01); H05K 3/4644 (2013.01); H05K 3/4652 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01); H05K 2203/0582 (2013.01); H05K 2203/0588 (2013.01); H05K 2203/072 (2013.01); H05K 2203/107 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01)] 7 Claims
OG exemplary drawing
 
1. A method of forming a multi-layer circuit on a curved substrate, the method comprising:
forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate;
applying a first layer of paint to the first layer of the multi-layer circuit;
forming; by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint, the second layer of the multi-layer circuit being electrically coupled to the first layer of the multi-layer circuit;
applying a second layer of the paint over the second layer of the multi-layer circuit; and
forming, by the laser direct structuring process, a third layer of the multi-laver circuit on the second layer of the paint, the third layer of the multi-layer circuit being electrically coupled to the second layer of the multi-layer circuit.