CPC H05K 1/181 (2013.01) [H01G 4/38 (2013.01); H05K 1/0272 (2013.01); H05K 1/145 (2013.01); H05K 3/328 (2013.01); H01G 4/30 (2013.01); H01L 25/072 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10545 (2013.01)] | 55 Claims |
1. A high-density multi-component package comprising:
a first module interconnect pad; and
a second module interconnect pad;
an array of electronic components mounted to and between said first module interconnect pad and said second module interconnect pad wherein a first electronic component of said electronic components is vertically oriented relative to said first module interconnect pad and a second electronic component of said electronic components is vertically oriented relative to said second module interconnect pad;
wherein said first electronic component and said second electronic component are first adjacent electronic components wherein said first electronic component and said second electronic component have opposite polarity; and
a positive connector tab in electrical connection with adjacent external terminations having positive polarity.
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