US 11,744,017 B2
Electronic device including interposer
Sangwon Ha, Suwon-si (KR); Subyung Kang, Suwon-si (KR); Sanghoon Park, Suwon-si (KR); Soohyun Seo, Suwon-si (KR); Yongjin Woo, Suwon-si (KR); and Yeomoon Yoon, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 7, 2020, as Appl. No. 16/868,941.
Claims priority of application No. 10-2019-0086151 (KR), filed on Jul. 17, 2019.
Prior Publication US 2021/0022247 A1, Jan. 21, 2021
Int. Cl. H05K 1/14 (2006.01); H01L 23/40 (2006.01)
CPC H05K 1/145 (2013.01) [H05K 1/144 (2013.01); H01L 2023/4087 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing;
a first printed circuit board disposed in an internal space of the housing and comprising a plurality of first conductive terminals; and
a second printed circuit board disposed parallel to the first printed circuit board in the internal space and comprising a plurality of second conductive terminals electrically connected to the plurality of first conductive terminals,
wherein the second printed circuit board comprises:
at least some conductive terminals of the plurality of second conductive terminals, and
at least one connection failure prevention structure disposed around the at least some conductive terminals of the plurality of second conductive terminals,
wherein the at least one connection failure prevention structure comprises an overflow preventing portion disposed to at least partially enclose at least one conductive terminal at a periphery of the at least one conductive terminal of the plurality of second conductive terminals,
wherein the overflow preventing portion comprises at least one support structure disposed around the at least one conductive terminal in the second printed circuit board and a recess at least partially formed by the at least one support structure, and
wherein the at least one support structure is disposed to maintain a distance between the first printed circuit board and the second printed circuit board.