US 11,744,014 B2
Flexible circuit board
Jun Young Lim, Seoul (KR); Woong Sik Kim, Seoul (KR); and Hyung Kyu Yoon, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Nov. 10, 2021, as Appl. No. 17/523,421.
Application 17/523,421 is a continuation of application No. 16/688,476, filed on Nov. 19, 2019, granted, now 11,202,367.
Application 16/688,476 is a continuation of application No. 15/765,308, granted, now 10,517,172, previously published as PCT/KR2016/010300, filed on Sep. 12, 2016.
Claims priority of application No. 10-2015-0140252 (KR), filed on Oct. 6, 2015.
Prior Publication US 2022/0071005 A1, Mar. 3, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 3/28 (2006.01); H05K 1/03 (2006.01); H05K 3/24 (2006.01)
CPC H05K 1/09 (2013.01) [H05K 1/028 (2013.01); H05K 1/0393 (2013.01); H05K 1/181 (2013.01); H05K 3/28 (2013.01); H05K 3/3452 (2013.01); H05K 1/111 (2013.01); H05K 1/18 (2013.01); H05K 1/189 (2013.01); H05K 3/244 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/10136 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A flexible printed circuit board (FPCB), comprising:
a base;
a first metal layer and a second metal layer on respective surfaces of the base;
a first plating layer on the first metal layer;
a second plating layer under the second metal layer;
a first insulating pattern provided on the first plating layer; and
a second insulating pattern under a part of the second plating layer,
wherein a thickness of the first plating layer between the first insulating pattern and the base is less than a thickness of the second plating layer between the second insulating pattern and the base, and
wherein an upper surface of the first plating layer has a step portion, and a lower surface of the second plating layer does not have a step portion.