CPC H05B 3/26 (2013.01) [H01J 37/32532 (2013.01); H01J 37/32642 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01L 21/68757 (2013.01); H05B 3/262 (2013.01)] | 18 Claims |
1. A placing table configured to place a workpiece thereon, the placing table comprising:
an electrostatic chuck configured to attract the workpiece;
a support member configured to support a focus ring; and
a metal base having a first region configured to support the electrostatic chuck and a second region configured to support the support member, the second region surrounding the first region,
wherein the support member includes:
an intermediate layer formed of a ceramic sintered compact and supported on the second region via an adhesive;
a thermally sprayed ceramic layer formed on the intermediate layer by a thermal spraying method; and
a heater electrode provided within the thermally sprayed ceramic layer, the heater electrode being formed by the thermal spraying method,
wherein the thermally sprayed ceramic layer includes a first film above the intermediate layer and extending below the heater electrode, and a second film above the first film, the second film extending above the heater electrode,
the placing table further comprising:
a power feeding contact formed of a conductive ceramic material extending through the intermediate layer, the power feeding contact electrically connected to the heater electrode;
a heater power supply;
an electrical contact connected to a bottom of the power feeding contact; and
a first wiring connected to the electrical contact, the first wiring providing power from the heater power supply to the electrical contact.
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