US 11,743,973 B2
Placing table and plasma processing apparatus
Dai Kitagawa, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Oct. 30, 2020, as Appl. No. 17/85,591.
Application 17/085,591 is a continuation of application No. 14/730,520, filed on Jun. 4, 2015, abandoned.
Claims priority of application No. 2014-128852 (JP), filed on Jun. 24, 2014; and application No. 2015-008447 (JP), filed on Jan. 20, 2015.
Prior Publication US 2021/0051772 A1, Feb. 18, 2021
Int. Cl. H05B 3/26 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01)
CPC H05B 3/26 (2013.01) [H01J 37/32532 (2013.01); H01J 37/32642 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01L 21/68757 (2013.01); H05B 3/262 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A placing table configured to place a workpiece thereon, the placing table comprising:
an electrostatic chuck configured to attract the workpiece;
a support member configured to support a focus ring; and
a metal base having a first region configured to support the electrostatic chuck and a second region configured to support the support member, the second region surrounding the first region,
wherein the support member includes:
an intermediate layer formed of a ceramic sintered compact and supported on the second region via an adhesive;
a thermally sprayed ceramic layer formed on the intermediate layer by a thermal spraying method; and
a heater electrode provided within the thermally sprayed ceramic layer, the heater electrode being formed by the thermal spraying method,
wherein the thermally sprayed ceramic layer includes a first film above the intermediate layer and extending below the heater electrode, and a second film above the first film, the second film extending above the heater electrode,
the placing table further comprising:
a power feeding contact formed of a conductive ceramic material extending through the intermediate layer, the power feeding contact electrically connected to the heater electrode;
a heater power supply;
an electrical contact connected to a bottom of the power feeding contact; and
a first wiring connected to the electrical contact, the first wiring providing power from the heater power supply to the electrical contact.