US 11,743,656 B2
Multi-stage structure-borne sound and vibration sensor
Darin Krajewski, White Lake, MI (US); Yu Du, Chicago, IL (US); Péter Atilla Kardos, Budapest (HU); and Flórián Czinege, Budapest (HU)
Assigned to Harman International Industries, Incorporated, Stamford, CT (US)
Filed by Harman International Industries, Incorporated, Stamford, CT (US)
Filed on May 27, 2021, as Appl. No. 17/332,492.
Prior Publication US 2022/0386039 A1, Dec. 1, 2022
Int. Cl. H04R 17/02 (2006.01)
CPC H04R 17/02 (2013.01) 20 Claims
OG exemplary drawing
 
1. A multi-stage sound and vibration sensor comprising:
a housing; and
a first piezo-diaphragm and a second piezo-diaphragm positioned in the housing to detect an input signal including audio or vibrations;
wherein the first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations,
wherein the housing includes a first wall having a first side and a second side, the first side and the second side of the housing at least defining a cavity positioned therebetween, the cavity is recessed within the first wall of the housing to receive electronics positioned on a printed circuit board (PCB), and
wherein the PCB is attached to an underside of the first side and the second side of the first wall to enable the electronics to be received within the cavity.